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Technical Data Sheet 24K Pure Gold Plating Solution Gold Plating Services' 24K Pure Gold Plating Solution is designed to produce a gold electro-deposit of 99.9%+ gold purity for devices used in the semi-conductor, electronic, and PWB industries where high purity gold are required. Electrodeposited gold will be equivalent to Type III, Grade A, specifications as indicated in MIL-G-45204C, as follows: |
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Purity |
99.9%+ | |
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Hardness |
80 - 90 Knoop | |
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Solution Metallic Content |
1 troy oz per gallon | |
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Range |
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| Operating Temperature | 145 - 160 ° F | |
| Anode to Cathode ratio | 2:1 or higher | |
| Specific Gravity | 10 - 16 Be | |
| pH (electrometric) | 5.8 - 6.4 | |
| Time to deposit 0.0001" (2.5microns) | 13 minutes @ 3 ASF | |
| Replenishment | 1 troy oz Pure Gold Replenisher solution every 300 ampere minutes | |
| Filtration | Continuous | |
| Efficiency | 110 mg/ampere minute | |
| Current Density | 3 ASF | |
| Anode | Platinized Columbium, Platinized Titanium | |
| Agitation | Vigorous cathode movement or solution pumping | |
To insure consistency of deposit,
the following operating conditions should be controlled:
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| Read and understand MSDS sheets before using: For professional use by trained technicians only. | ||