Bath & Brush Application

Gold Plating Services’ Copper Strike Solution is to be used as a pre-treatment step following proper electro-cleaning and surface activation. Our Copper Strike Solution is an alkaline, non-cyanide, copper plating solution that can be used as a pre-treatment “strike” for many steel or mild steel items following the electro-cleaning step without other activation done prior. This solution will deposit a thin layer of pure copper to the surface for maximum adhesion.

This solution is intended to be an activation step to help eliminate possible wetting out or oxidation issues and is not to be used as a final plate. It should be followed with a diffusion barrier or final plate depending on the base material. 

Usage Notes: 

  • This is a consumable solution - the components break down with use and it is not intended to be replenished. 
  • Top off all evaporation loss with distilled water.
  • Provide ventilation.
  • A faint copper deposit is a result of components within the bath breaking down and is a sign that it may be time to replace the solution.

Operating Conditions

Temperature -   Bath: 130° F
Brush: Room

Anode -   Bath: Copper, Stainless Steel, or Platinized Titanium
Brush: Stainless Steel Bit with a Cotton Sleeve
Note: Anodes will break down over time and will need to be replaced.

Voltage -   Bath: 0.80 Volts Optimum
Brush: 2-4 Volts

Time -   20 - 30 Seconds, or until the surface shows a light copper tint

Agitation -   Moderate

Shelf Life - If stored at room temperature, properly sealed solution has
a shelf life of ~2 years

Read and understand SDS sheets before using. For professional use by trained technicians only.