24K Pure Gold Plating Solution - Pen




Gold Plating Services’ 24k Pure Pen Gold Solution is an extremely efficient, (cathode efficiency 98%+ ), neutral pH, water clear gold plating solution designed to produce a gold electro-deposit of 99.9+% purity to virtually any desired thickness for surfaces used in the medical, semi-conductor, electronic, and PWB industries where soft, high purity gold is required. This high gold content brush gold formulation can be applied at room temperature using our standard sleeves with a platinized anode. Commonly used for "wire bonding gold plating applications, the electrodeposited gold will be equivalent to Type III, Grade A, specification as indicated in MIL-DTL- 45204D. 

A 1 oz jar contains sufficient gold to cover ~ 300 - 400 square inches of area to a thickness of 10 micro-inches; depending on application waste.

What you will need to use this solution properly: 

Our 24K Pure Pen Gold Plating Solution is an electroplating bath that requires the proper equipment and supplies to be used. We recommend electroplating equipment such as our "PCB Repair Kit" or "Universal Plater". Either of these kits will have everything you need to apply this solution for most applications, including the following minimum required items.

Minimum Required Items

  1. A source of direct current voltage with a controllable voltage range of one to six volts, (1 VDC - 6 VDC).
  2. An absorbent application "Tip" that will carry the solution. Available as medium or Ultra-Fine. 
  3. An application handle that will hold the application "Tip" and provide electrical connectivity to the positive terminal of the power source.
  4. A common lead or ground clip that will provide electrical connectivity from the negative, (-) terminal of the power source and the surface being plated.

Safety Data Sheet  for this product.

Technical Data Sheet for this product.