24K Pure Gold Plating Solution - PenPlating Solutions
24k Pure Pen Gold Solution is an extremely efficient, neutral pH, water-clear gold plating solution designed to produce a gold electro-deposit of 99.9+% purity to virtually any desired thickness for surfaces used in the medical, semi-conductor, electronic, and PWB industries where soft, high purity gold is required. This high gold content brush gold formulation can be applied at room temperature using our standard sleeves with a platinized anode. Commonly used for "wire bonding gold plating applications, the electro-deposited gold will be equivalent to Type III, Grade A, specification as indicated in MIL-DTL- 45204D. Cathode efficiency 98%+
A 1oz jar contains sufficient gold to cover ~400 square inches of area to a thickness of 10 micro-inches; depending on application waste.
Check out our New Plating Procedure Chart for details about our products and how to use them.
What you will need to use this solution properly:
Our 24K Pure Pen Gold Plating Solution is an electroplating bath that requires electroplating equipment such as our PCB Repair Kit or Universal Plater. Either of these kits will have everything you need to apply this solution for most applications.
Minimum Required Items
- A source of direct current voltage with a controllable voltage range of one to six volts, (1 VDC - 6 VDC).
- An absorbent application Tip, Medium or Ultra-Fine, that will carry the solution.
- An application handle that will hold the application Tip and provide electrical connectivity to the positive terminal of the power source.
- A common lead or ground clip that will provide electrical connectivity from the negative (-) terminal of the power source and the surface being plated.
Safety Data Sheet for this product.
Technical Data Sheet for this product.
California residents: Click here for Proposition 65 warning.